CMP systems perform a series of steps to flatten the wafer and clean and dry it. Because the wiring width is measured in nanometers (nm), flattening accuracy is also required in nanometers. Specifically, for a wafer with a diameter of 30 cm, the required flattening accuracy is within 10 nm, which is equivalent to the irregularity of 5 mm on the inner side of the Yamanote rail line (with an average diameter of 10 km). This high-precision flattening technology contributes to the high integration of state-of-the-art semiconductor devices.
These technologies produced by the Precision Machinery Company have been realized through continuous development in close cooperation with our customers since the first CMP system was shipped in 1992. The EBARA Group will continue to devote itself to technology development for cutting-edge semiconductor manufacturing.